TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

TG-6 Thermaltake high performance and reliable Thermal grease

TG-7 Thermaltake high performance and reliable Thermal grease with diamond powder

TG-8 Thermaltake high performance and reliable Thermal grease with diamond powder

Thermaltake high performance and exceptional reliability Thermal grease

Thermaltake high performance and exceptional reliability Thermal grease

Application for CPU, GPU, Chipset, and other PC components